Cutting For Electronics & Technical Applications

Precision hard material cutting tools are engineered for applications requiring micron-level accuracy on brittle or delicate hard materials. They enable clean, chip-free cutting where thermal damage or micro-fractures must be avoided.

Application Scenarios:

• Dicing silicon wafers, glass substrates, and semiconductor materials

• Cutting technical ceramics for medical devices and sensors

• Trimming hardened steel components in watchmaking and precision engineering

• Sectioning geological samples and mineral specimens

Features:

• Ultra-thin diamond or CBN (cubic boron nitride) blades

• High-speed spindles for vibration-free operation

• Coolant-through designs for heat management

• Custom edge geometries for specific material properties